RF2498
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
A = 0.74 x 0.38 (mm) Typ.
B = 0.38 x 0.74 (mm) Typ.
C = 3.60 (mm) Sq.
3.50 Typ.
0.50 Typ.
Dimensions in mm.
Pin 32
Pin 1
BBBBBBBB
Pin 24
S A
0.50 Typ.
A
N A
A
A
A 1.75 Typ.
A
A
C
3.50 Typ.
G A
A
I A
A
A
A
ES 0.55 Typ.
A
A
BBBBBBBB
D 0.55 Typ.
Pin 16
1.75 Typ.
NEW Figure 2. PCB Solder Mask Pattern (Top View)
FOR
NOT
Rev A4 070308
8-319