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RF3164PCBA View Datasheet(PDF) - RF Micro Devices

Part Name
Description
MFG CO.
RF3164PCBA
RFMD
RF Micro Devices RFMD
'RF3164PCBA' PDF : 10 Pages View PDF
1 2 3 4 5 6 7 8 9 10
RF3164
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is
3µinch to 8µinch gold over 180µinch nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ.
B = 0.28 x 0.64 (mm) Typ.
C = 0.78 x 0.64 (mm)
D = 0.64 x 1.28 (mm)
E = 1.50 (mm) Sq.
Dimensions in mm.
1.50 Typ.
0.75 Typ.
Pin 16
BCB
Pin 1 A
0.50 Typ.
A
D
E
A
A
0.55 Typ.
0.55 Typ.
A
BBBB
Pin 8
0.75 Typ.
0.75 1.00 Typ.
Typ.
Figure 1. PCB Metal Land Pattern (Top View)
2-8
Rev A2 050112
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