RHF310AK01V View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'RHF310AK01V' PDF : 25 Pages View PDF
RHF310A
Package information
7
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
7.1
Ceramic Flat-8 package information
Figure 29. Ceramic Flat-8 package outline
Pin n° 1
identification
Note:
The upper metallic lid is electrically connected to pin 5. No other pin is electrically connected to the metallic lid
nor to the IC die inside the package.
DS6201 - Rev 7
page 17/25
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