RMWM26001 View Datasheet(PDF) - Raytheon Company
Part Name
Description
MFG CO.
'RMWM26001' PDF : 8 Pages View PDF
RMWM26001
26 GHz Mixer MMIC
Figure 1
Functional Block
Diagram
Up-Conversion
MMIC Chip
RF OUT
IF IN
PRODUCT INFORMATION
Down-Conversion
MMIC Chip
RF IN
IF OUT
Ground
(Back of Chip)
Figure 2
Chip Layout and Bond
Pad Locations
Chip Size is 1.95 mm x
1.5 mm x 100 µm. Back
of chip is RF ground
Dimensions in mm
0.0
1.5
LO IN
Ground
(Back of Chip)
LO IN
0.831 0.986 1.141
1.95
1.5
0.323
0.1805
0.0
0.0
0.3225
0.18
0.0
1.95
www.raytheonrf.com
Characteristic performance data and specifications are subject to change without notice.
Revised March 14, 2001
Page 2
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
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