S-812C View Datasheet(PDF) - Unspecified
Part Name
Description
MFG CO.
'S-812C' PDF : 57 Pages View PDF
0.52
2
1.36
0.52
0.2 0.3 1
1.
2.
1.
2.
3.
4.
SNT
(0.25 mm min. / 0.30 mm typ.)
(1.30 mm ~ 1.40 mm)
0.03 mm
1. Pay attention to the land pattern width (0.25 mm min. / 0.30 mm typ.).
2. Do not widen the land pattern to the center of the package (1.30 mm to 1.40 mm).
Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package.
2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm
or less from the land pattern surface.
3. Match the mask aperture size and aperture position with the land pattern.
4. Refer to "SNT Package User's Guide" for details.
1.
(0.25 mm min. / 0.30 mm typ.)
2.
(1.30 mm ~ 1.40 mm)
No. PI006-A-L-SD-4.1
TITLE
No.
ANGLE
UNIT
SNT-6A(H)-A
-Land Recommendation
PI006-A-L-SD-4.1
mm
ABLIC Inc.
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