S108T02 View Datasheet(PDF) - Sharp Electronics
Part Name
Description
MFG CO.
'S108T02' PDF : 5 Pages View PDF
Fig.2 RMS ON-state Current vs. Ambient
Temperature
9
Al plate
8
SSR
7
(3) (2)
(1)
6
5
(4)
4
(5)
3
2
1
0
−25 0
25 50 75 100 125
Ambient temperature Ta (°C)
Fig.3 RMS ON-state Current vs. Case
Temperature
10
9
8
7
6
5
4
3
2
1
0
−25 0
25 50 75 100 125
Case temperature TC (°C)
Fig.5 Surge Current vs. Power-on Cycle
100
80
60
40
20
0
1
f=60Hz
Tj=25°C start
10
100
Power-on cycle (Times)
S108T01/S108T02/S208T01/S208T02
(1) With infinite heat sink
(2) With heat sink (200×200×2mm Al plate)
(3) With heat sink (100×100×2mm Al plate)
(4) With heat sink (50×50×2mm Al plate)
(5) Without heat sink
(Note) With the Al heat sink set up vertically, tighten the
device with a torque of 0.4N•m and apply thermal
conductive silicone grease on the mounting face of
heat sink. Forced cooling shall not be carried out.
(Please use an isolation sheet if necessary.)
Fig.4 Forward Current vs. Forward Voltage
50
Ta=75°C
50°C
10
5
25°C
0°C
−25°C
1
0.5
0.1
0.6 0.8 1.0 1.2 1.4 1.6 1.8
Forward voltage VF (mA)
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