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S116S02F View Datasheet(PDF) - Sharp Electronics

Part Name
Description
MFG CO.
'S116S02F' PDF : 13 Pages View PDF
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Fig.1 Forward Current vs. Ambient
Temperature
60
50
40
30
20
10
0
25 0
25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.2 RMS ON-state Current vs.
Ambient Temperature
20
18
16
(3) (2)
(1)
14
(4)
12
10
8
6
4
(5)
2
0
25 0
25 50 75 100 125
Ambient temperature Ta (˚C)
Fig.3 RMS ON-state Current vs.
Case Temperature
16
14
12
10
8
6
4
2
0
25 0
25 50 75 100 125
Case temperature Tc (˚C)
S116S02 Series
S216S02 Series
(1) With infinite heat sink
(2) With heat sink (280×280×2mm Al plate)
(3) With heat sink (200×200×2mm Al plate)
(4) With heat sink (100×100×2mm Al plate)
(5) Without heat sink
(Note) In natural cooling condition, please locate Al
plate vertically, spread the thermal conductive
silicone grease on the touch surface of the
device and tighten up the device in the center
of Al plate at the torque of 0.4N • m.
Fig.4 Forward Current vs. Forward Voltage
100
Ta=100˚C
75˚C
50˚C
10
25˚C
0˚C
25˚C
1
0
1.0
2.0
Forward voltage VF (V)
Sheet No.: D4-A02701EN
6
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