SC1211VXSTR View Datasheet(PDF) - Semtech Corporation
Part Name
Description
MFG CO.
SC1211VXSTR
Semtech Corporation
'SC1211VXSTR' PDF : 11 Pages View PDF
POWER MANAGEMENT
Applications Information (Cont.)
whole during PCB layout. Refer to Semtech SC2643VX/
SC1211VX EVB Layout Guideline.
For the SC1211VX driver, the following guidelines are
typically recommended during PCB layout:
1. Place the SC1211VX close to the FETs for shortest
gate drive traces and ground return paths.
2. Connect the bypass capacitor as close as possible to
pin VCC and PGND for decoupling.
3. Locate the components of the bootstrap circuit close
to the SC1211VX.
SOLDERING CONSIDERATION
The exposed die pad of the SC1211VX is used for ground
return and thermal release of the driver. The pad must
be soldered to the ground plane that is further connected
to the system ground in the inner layer through multiple
vias. For better electrical and thermal performance, it is
recommended to use all copper available under the driver
as the ground plane, and place the vias as close as pos-
sible to the solder pad. Meanwhile, the vias have to be
masked out to prevent solder leakage during reflow. The
layout arrangement is detailed in the above figure, which
also can be found in the āLand Pattern ā Power SOIC-8ā
section.
Solder Pad
Solder Mask
Copper
Vias
ļ£© 2005 Semtech Corp.
10
SC1211VX
www.semtech.com
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