SC4519 View Datasheet(PDF) - Semtech Corporation
Part Name
Description
MFG CO.
'SC4519' PDF : 15 Pages View PDF
POWER MANAGEMENT
Land Pattern - SOIC-8L-EDP
SC4519
E
D
(C) F
THERMAL VIA
P
Ø 0.36mm
SOLDER MASK
GZ
Y
X
DIM
C
D
E
F
G
P
X
Y
Z
DIMENSIONS
INCHES MILLIMETERS
(.205)
(5.20)
.134
3.40
.201
5.10
.101
2.56
.118
3.00
.050
1.27
.024
0.60
.087
2.20
.291
7.40
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2. REFERENCE IPC-SM-782A, RLP NO. 300A.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
Contact Information
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
2007 Semtech Corp.
15
www.semtech.com
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