SCA100T View Datasheet(PDF) - Murata Manufacturing
Part Name
Description
MFG CO.
'SCA100T' PDF : 17 Pages View PDF
SCA100T Series
4.2 Reflow Soldering
The SCA100T is suitable for Sn-Pb eutectic and Pb- free soldering process and mounting with
normal SMD pick-and-place equipment.
Figure 17. Recommended SCA100T body temperature profile during reflow soldering. Ref.
IPC/JEDEC J-STD-020B.
Profile feature
Sn-Pb Eutectic
Assembly
Pb-free Assembly
Average ramp-up rate (TL to TP)
3°C/second max.
3°C/second max.
Preheat
- Temperature min (Tsmin)
- Temperature max (Tsmax)
- Time (min to max) (ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Tsmax to T, Ramp up rate
3°C/second max
Time maintained above:
- Temperature (TL)
183°C
217°C
- Time (tL)
Peak temperature (TP)
Time within 5°C of actual Peak Temperature (TP)
Ramp-down rate
60-150 seconds
240 +0/-5°C
10-30 seconds
6°C/second max
60-150 seconds
250 +0/-5°C
20-40 seconds
6°C/second max
Time 25° to Peak temperature
6 minutes max
8 minutes max
The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-020B. The part
should be delivered in a dry pack. The manufacturing floor time (out of bag) in the customer’s end
is 168 hours.
Notes:
Preheating time and temperatures according to guidance from solder paste manufacturer.
It is important that the part is parallel to the PCB plane and that there is no angular alignment
error from intended measuring direction during assembly process.
Wave soldering is not recommended.
Ultrasonic cleaning is not allowed. The sensing element may be damaged by an ultrasonic
cleaning process
Murata Electronics Oy
www.muratamems.fi
Subject to changes
Doc. nr. 8261800
17/17
Rev.B2
Share Link: 
