SMP-03 Case
10-Terminal Ceramic Surface-Mount Case
7 x 5 mm Nominal Footprint
Recommended PCB Footprint
Case Dimensions
Dimension
Min
A
6.80
B
4.80
C
-
D
0.47
E
2.41
H
0.87
J
4.87
K
2.87
P
1.14
mm
Nom
7.00
5.00
1.65
0.60
2.54
1.00
5.00
3.00
1.27
Max
7.20
5.20
2.00
0.73
2.67
1.13
5.13
3.13
1.40
Min
0.268
0.189
-
0.019
0.095
0.034
0.192
0.113
0.045
Inches
Nom
0.276
0.197
0.065
0.024
0.100
0.039
0.197
0.118
0.050
Max
0.283
0.205
0.079
0.029
0.105
0.044
0.202
0.123
0.055
Electrical Connections
Connection
Input
Port 1
Input
Output TDM1
Port 2
Output TDM1
Output TDM2
Port 3
Output TDM2
Ground
Terminals
1
10
6
7
4
5
All others
Solder Pad
Plating
Lid Plating
Body
Pb Free
Materials
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
2.0 to 3.0 µm Nickel
Al2O3 Ceramic
C
B
H
E
H
A
D
J
P
K
www.RFM.com E-mail: info@rfm.com
©2009-2010 by RF Monolithics, Inc.
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