Version 1.3
Recommended Solder Pad
SFH 314 FA
Dimensions in mm.
Note:
pad 1: emitter
TTW Soldering
IEC-61760-1 TTW
300
˚C
T 250
10 s max., max. contact time 5 s per wave
235 ˚C - 260 ˚C
First wave
Second wave
200
∆T < 150 K
Preheating
150
130 ˚C
120 ˚C
100 100 ˚C
Typical
OHA04645
Continuous line: typical process
Dotted line: process limits
Cooling
ca. 3.5 K/s typical
ca. 2 K/s
ca. 5 K/s
50
0
0 20 40 60 80 100 120 140 160 180 200 220 s 240
t
2016-01-04
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