SFH3401-Z View Datasheet(PDF) - OSRAM GmbH
Part Name
Description
MFG CO.
'SFH3401-Z' PDF : 15 Pages View PDF
Version 1.0
Recommended Solder Pad
Empfohlenes Lötpaddesign
SFH 3401
1.8
2.4
1.8
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for improved
heat dissipation
OHF02393
Dimensions in mm. / Maße in mm.
Reflow Soldering Profile
Reflow-Lötprofil
Preconditioning: JEDEC Level 4 acc. to JEDEC J-STD-020D.01
300
˚C
T 250
240 ˚C
217 ˚C
tP
200
tL
150
tS
100
OHA04525
Tp 245 ˚C
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
2008-07-30
11
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