SFH4239 View Datasheet(PDF) - OSRAM GmbH
Part Name
Description
MFG CO.
'SFH4239' PDF : 9 Pages View PDF
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Achtung:
Anode und Heatsink sind
elektrisch verbunden
Attention:
Anode and Heatsink are
electrically connected
3 Lötstellen
3 solder points
Thermisch optimiertes PCB
Thermal enhanced PCB
11.6 (0.457)
1.6 (0.063)
ø4.0 (0.157)
Heatsink attach
Footprint
SFH 4239
Empfohlene
Padgeometrie
Recommended Solder
Pad Design
ø2.5 (0.098)
ø4.0 (0.157)
Maße in mm (inch) / Dimensions in mm (inch).
2010-05-18
12.0 (0.472)
11.6 (0.457)
Kupfer
Copper
1.6 (0.063)
1 (0.039)
Lötstopplack
Solder resist
Lötpasten Schablone
Solder paste stencil
Freies Kupfer
Bare Copper
OHPY3638
7
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