SFH4259 View Datasheet(PDF) - OSRAM GmbH
Part Name
Description
MFG CO.
'SFH4259' PDF : 10 Pages View PDF
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
2.3 (0.091)
0.8 (0.031)
SFH 4258, SFH 4259
Reflow Löten
Reflow Soldering
3.3 (0.130)
3.3 (0.130)
0.7 (0.028)
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
6.1 (0.240)
2.8 (0.110)
Cu Fläche /
Cu-area
Lötstoplack
Solder resist
16 mm2 per pad
OHFP3021
Wellenlöten TTW
TTW Soldering
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
2007-04-25
2.8 (0.110) 0.5 (0.020)
Lötstoplack
Solder resist
Cu Fläche / > 16 mm2 per pad
Cu-area
OHPY3040
8
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