SL3522AMC View Datasheet(PDF) - Mitel Networks
Part Name
Description
MFG CO.
'SL3522AMC' PDF : 19 Pages View PDF
SL3522
1
46
2
45 44 43 42
41 40
3
4
5 6 7 8 9 10 11 12
13 14
39 38 37 36 35 34
33 32
47
48
49
50
51
15 16
52
17 18
31 30
19 20
29 28
27
26
25
24
23
21 22
5.480mm
TO SCALE
TERMINALS ((X) DENOTES MC PACKAGE PIN NUMBER)
1 Video O/P (13)
2 Video O/P VCC (14)
3 Gain VCC (15)
4 Video GND (16)
14 VEE 5A (22)
15 VEE 4A (22)
16 GND 4B (23)
17 GND 3A (23)
27 Test point
28 VEE 1B (3)
29 GND 1B (4)
30 GND 2B (4)
40 VEE 5B (7)
41 RF BUF O/P GND (8)
42 RF BUF O/P GND (8)
43 RF O/P – (9)
5 Offset ADJ (17)
6 Trim REF (18)
7 Gain ADJ (19)
8 Gain VEE (20)
9 Test point
10 Test point
18 VEE 3A (24)
19 VEE 2A (24)
20 GND 2A (25)
21 GND 1A (25)
22 VEE 1A (26)
23 Test point
31 VEE 2A (5)
32 VEE 3A (5)
33 GND 3B (6)
34 Test point
35 Test point
36 Test point
44 RF O/P + (10)
45 RF BUF O/P VEE (11)
46 Video O/P VEE (12)
47 Test point
48 Test point
49 Test point
11 VEE 6A (20)
12 GND 6A (21)
24 RF I/P signal (27)
25 Test point
37 Test point
38 GND 4B (6)
50 Test point
51 Test point
13 GND 5A (21)
26 RF I/P return (28)
39 VEE 4B (7)
52 Test point
NOTES
1. All pads with square cross–section =120 m 120 m
2. All pads with octagonal cross–section =100 m 100 m
3. Chip is passivated with polyimide
Fig.25 SL3522 pad map for bare IC dice
17
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