SMM150ECR04 View Datasheet(PDF) - Summit Microelectronics
Part Name
Description
MFG CO.
'SMM150ECR04' PDF : 22 Pages View PDF
SMM150
Preliminary Information
PART MARKING – QFN PACKAGE
28 Pad QFN
20 Ball Ultra CSPTM
SUMMIT
SMM150N SS
Annn L AYYWW
Summit
Part Number
Status Tracking Code
(Blank, MS, ES, 01, 02,...)
(Summit Use)
X is the sequential letter per wafer
(i.e. A for the first wafer, B for the second wafer,
C for the third wafer, etc.)
Ball A1
Identifier
Summit Part Number
Pin 1
Drawing not
to scale
Date Code (YYWW)
Lot tracking code (Summit use)
100% Sn, RoHS compliant, Green
Part Number suffix
(Contains Customer specific
ordering requirements)
Product Tracking Code (Summit use)
ORDERING INFORMATION
Drawing not
to scale
100% Sn, RoHS compliant,
Green
Date Code
Y = Single digit year
(4=2004, 5=2005, etc)
Summit
Part
SMM150 N C nnn V
V is the Lead-Free Attribute for the CSP
(E Package), L is for the QFN (N package)
Number
Package
Temp Range
Part Number Suffix (see page 19)
Customer specific requirements are contained
N=28 Pad QFN
C=Commercial in the suffix such as Hex code, Hex code
E=20 Ball Ultra CSPTM Blank=Industrial revision, etc.
NOTICE
NOTE 1 - This is a Preliminary Information data sheet that describes a Summit product currently in pre-production with limited characterization.
SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design,
performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license
under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained
herein reflect representative operating parameters, and may vary depending upon a user’s specific application. While the information in this
publication has been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or
omission.
SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the failure or
malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness.
Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that:
(a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc.
is adequately protected under the circumstances.
Revision 2.6 - This document supersedes all previous versions. Please check the Summit Microelectronics, Inc. web site at
www.summitmicro.com for data sheet updates.
© Copyright 2005 SUMMIT MICROELECTRONICS, Inc. PROGRAMMABLE ANALOG FOR A DIGITAL WORLD™
I2C is a trademark of Philips Corporation, Ultra CSPTM is a registered name of FlipChip International, LLC.
Summit Microelectronics, Inc
2075 2.6 05/13/05
22
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