SMP75-8 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'SMP75-8' PDF : 8 Pages View PDF
SMP75-8
Figure 13: SMB Package Mechanical data
E1
D
E
A1
C
A2
L
b
REF.
A1
A2
b
c
E
E1
D
L
DIMENSIONS
Millimeters
Inches
Min. Max. Min. Max.
1.90
2.45 0.075 0.096
0.05
0.20 0.002 0.008
1.95
2.20 0.077 0.087
0.15
0.41 0.006 0.016
5.10
5.60 0.201 0.220
4.05
4.60 0.159 0.181
3.30
3.95 0.130 0.156
0.75
1.60 0.030 0.063
Figure 14: Foot Print Dimensions (in millimeters)
2.3
1.52
2.75
1.52
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 6: Ordering Information
Part Number
Marking
SMP75-8
L08
Package
SMB
Weight
0.11 g
Base qty
2500
Delivery mode
Tape & reel
Table 7: Revision History
Date
Revision
19-July-2005
3
02-Jan-2006
4
Description of Changes
Previous issue
Added ECOPACK statement and changed page layout.
Minor updates to technical values in Tables 2, 3, and 5.
7/8
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