ST7565 View Datasheet(PDF) - Unspecified
Part Name
Description
MFG CO.
'ST7565' PDF : 56 Pages View PDF
ST7565
PIN DIMENSIONS
99
100
Die No.
(0,0)
ST7565
134
135
Chip Size
Bump Pitch
Bump Size
Bump Height
Chip Thickness
9760 μm X 2440 μm
65 μm (Min.)
PAD No. 1~24
PAD No. 25~82
PAD No. 83~99
PAD No. 100
PAD No. 101~133
PAD No. 134
PAD No. 135
PAD No. 136~273
PAD No. 274
PAD No. 275
PAD No. 276~308
PAD No. 309
18 μm (Typ.)
457 μm
85 μm X 85 μm
64 μm X 85 μm
85 μm X 85 μm
85 μm X 73 μm
85 μm X 47 μm
85 μm X 73 μm
73 μm X 85 μm
47 μm X 85 μm
73 μm X 85 μm
85 μm X 73 μm
85 μm X 47 μm
85 μm X 73 μm
Master/slave mode cancel.
VOUT maximum -18V
ST7565-0A Temperature gradient = -0.15%/°C
Logic power supply VDD – VSS = 4.0V to 5.5 V
Booster 4 times cancel , 3 times , 2 times worked
In display reverse mode , used display off command : display pixels all on
In display reverse mode , used display all point on command : display pixels all off
1
309
275
274
Ver 1.0a
2/56
2002/06/24
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