ST7565P View Datasheet(PDF) - Unspecified
Part Name
Description
MFG CO.
'ST7565P' PDF : 71 Pages View PDF
ST7565P
ST7565P Pad Arrangement(COG)
PAD No
001~012, 103~114, 129~276
013~102
115, 290
116~128, 277~289
Bump Size
40µm x 90µm
56µm x 60µm
90µm x 25.5µm
90µm x 40µm
Chip Size
9,336µm x 1,000µm
Bump Pitch
58µm (Min.)
Bump Height
17µm (Typ)
Chip Thickness
635µm
Use select pin to define display duty as following table:
SEL 3 , 2 , 1
DUTY
BIAS
0,0,0
1/65
1/9 or 1/7
0,0,1
1/49
1/8 or 1/6
0,1,0
1/33
1/6 or 1/5
0,1,1
1/55
1/8 or 1/6
1,0,0
1/53
1/8 or 1/6
1, X , X
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Ver 2.1b
2/71
2009/09/14
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