ST7689-G4 View Datasheet(PDF) - Sitronix Technology Co., Ltd.
Part Name
Description
MFG CO.
ST7689-G4
Sitronix Technology Co., Ltd.
'ST7689-G4' PDF : 195 Pages View PDF
3. PAD ARRANGEMENT (COG)
ST7689
Chip Size : 11434 um x 701 um
Bump Pitch :
PAD1~19, 156~174, 175~235 pitch= 22um(min, com/seg)
PAD 236 ~ 619, 620~ 680 pitch= 22um(min, com/seg)
PAD 235 ~ 236, 619~620 pitch=116.33um (min, com/seg)
PAD 21~27,32~48, 50~51, 52~56, 58~59, 60~154 pitch= 80um(I/O)
PAD 27~29, 48~49, 56~57 pitch= 60um(I/O)
PAD 29~30, 31~32, 51~52, 59~60 pitch= 100um(I/O)
PAD 30~31 pitch= 120um(I/O)
PAD 49~50, 57~58 pitch= 40um(I/O)
Bump Size :
PAD30~31, 51, 59
PAD28, 49~50, 57~58
Bump width=105um (min, I/O)
Bump width=25um (min, I/O)
Bump space=15um (min, I/O)
Bump space=15um (min, I/O)
Bump length=63um(min, I/O)
Bump length=63um(min, I/O)
Bump area=6615um^2(I/O)
Bump area=1575um^2(I/O)
PAD21~27, 29, 32~48,
PAD1~19, 156~174, 175~235,
52~56, 60~154
236~619, 620~680
Bump width=65um (min, I/O)
Bump width=10.5um (min, com/seg)
Bump space=15um (min, I/O)
Bump space=11.5um (min, com/seg)
Bump length=63um(min, I/O)
Bump length=149.4um(min, com/seg)
Bump area=4095um^2(I/O)
Bump area=1568.7um^2(com/seg)
ST7689-G4 (Bump Height: 15um, Hardness: 75HV)
ST7689-G4-1 (Bump Height: 12um, Hardness: 90HV)
Chip Thickness: 300um
Alignment mark
The center of alignment mark: see bellow Table
Version 1.0
Page 10 of 195
2009/10
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