14.2 THERMAL CHARACTERISTICS
ST7LITE0xY0, ST7LITESxY0
Symbol
RthJA
TJmax
PDmax
Ratings
Package thermal resistance
(junction to ambient)
Maximum junction temperature 1)
Power dissipation 2)
SO16
DIP16
Value
95
TBD
150
500
Unit
°C/W
°C
mW
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.
The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT
where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the
ports used in the application.
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