STA011 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STA011' PDF : 38 Pages View PDF
Package information
8
Package information
STA011
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 12. TQFP44 mechanical data and package dimensions
DIM.
MIN.
mm
TYP.
MAX.
MIN.
inch
TYP.
MAX.
A
1.60
0.063
A1 0.05
0.15 0.002
0.006
A2 1.35 1.40 1.45 0.053 0.055 0.057
B 0.30 0.37 0.45 0.012 0.015 0.018
C 0.09
0.20 0.004
0.008
D 11.80 12.00 12.20 0.464 0.472 0.480
D1 9.80 10.00 10.20 0.386 0.394 0.401
D3
8.00
0.315
E 11.80 12.00 12.20 0.464 0.472 0.480
E1 9.80 10.00 10.20 0.386 0.394 0.401
E3
8.00
0.315
e
0.80
0.031
L 0.45 0.60 0.75 0.018 0.024 0.030
L1
1.00
0.039
k
0˚(min.), 3.5˚(typ.), 7˚(max.)
OUTLINE AND
MECHANICAL DATA
TQFP44 (10 x 10 x 1.4mm)
D
D1
33
34
23
22
A
A2
A1
0.10mm
.004
Seating Plane
36/38
44
1
e
12
11
TQFP4410
C
K
0076922 D
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