STM32F031E4T6 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
STM32F031E4T6
STMicroelectronics
'STM32F031E4T6' PDF : 106 Pages View PDF
Package information
STM32F031x4 STM32F031x6
Symbol
Table 65. WLCSP25 package mechanical data (continued)
millimeters
inches(1)
Min
Typ
Max
Min
Typ
aaa
-
0.100
-
bbb
-
0.100
-
ccc
-
0.100
-
ddd
-
0.050
-
eee
-
0.050
-
-
0.0039
-
0.0039
-
0.0039
-
0.0020
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
4. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
Figure 44. Recommended footprint for WLCSP25 package
'SDG
'VP
Max
-
-
-
-
-
:/&63B$1B)3B9
Table 66. WLCSP25 recommended PCB design rules
Dimension
Recommended values
Pitch
0.4 mm
Dpad
0.225 mm
Dsm
0.290 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.250 mm
Stencil thickness
0.100 mm
94/106
DocID025743 Rev 6
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