STM32F031K4Y7 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STM32F031K4Y7

ARM®-based 32-bit MCU with up to 32 Kbyte Flash, 9 timers, ADC and communication interfaces, 2.0 - 3.6 V

STMicroelectronics 

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STM32F031x4 STM32F031x6

Package information

7.7

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 18: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

• TA max is the maximum ambient temperature in °C,

• ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

• PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

• PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 68. Package thermal characteristics

Symbol

Parameter

Thermal resistance junction-ambient

LQFP48 - 7 × 7 mm

Thermal resistance junction-ambient

UFQFPN32 - 5 × 5 mm

Thermal resistance junction-ambient

LQFP32 - 7 × 7 mm

ΘJA Thermal resistance junction-ambient

UFQFPN28 - 4 × 4 mm

Thermal resistance junction-ambient

WLCSP25 - 2.13 x 2.07 mm

Thermal resistance junction-ambient

TSSOP20 - 6.5 x 4.4 mm

Value

55

38

56

118

74

110

Unit

°C/W

7.7.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

DocID025743 Rev 6

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