Qdatasheet_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

STM32F038C6T6TR View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
'STM32F038C6T6TR' PDF : 102 Pages View PDF
STM32F038x6
( E
Package information
Figure 33. UFQFPN32 package outline
'
H
'
E
$
GGG &
$
$
&
6($7,1*
3/$1(
H
( (


'
3,1,GHQWLILHU
/
/
!"?-%?6
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device
ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.
DocID026079 Rev 5
83/102
98
Share Link: GO URL

All Rights Reserved Ā© qdatasheet.com  [ Privacy Policy ] [ Contact Us ]