STM32F301C6T6 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STM32F301C6T6

ARM® Cortex®-M4 32-bit MCU+FPU, up to 64 KB Flash, 16 KB SRAM, ADC, DAC, COMP, Op-Amp, 2.0 – 3.6 V

STMicroelectronics 

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Package information

STM32F301x6 STM32F301x8

7.4

UFQFPN32 package information

Figure 45. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat

package outline

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1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device

ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.

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DocID025146 Rev 6

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