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STM32L152C6T6T View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
'STM32L152C6T6T' PDF : 133 Pages View PDF
Package information
STM32L151x6/8/B STM32L152x6/8/B
7.4
UFQFPN48 7 x 7 mm, 0.5 mm pitch, package information
Figure 41. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline
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1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
114/133
DocID17659 Rev 12
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