STM32L152CBT6 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
STM32L152CBT6
STMicroelectronics
'STM32L152CBT6' PDF : 133 Pages View PDF
STM32L151x6/8/B STM32L152x6/8/B
Electrical characteristics
Figure 28. Maximum dynamic current consumption on VREF+ supply pin during ADC
conversion
Sampling (n cycles)
ADC clock
Iref+
700µA
300µA
Conversion (12 cycles)
MS36686V1
Table 56. Maximum source impedance RAIN max(1)
RAIN max (kOhm)
Ts
(µs)
Multiplexed channels
Direct channels
Ts (cycles)
fADC= 16 MHz(2)
2.4 V < VDDA< 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA< 3.3 V 1.8 V < VDDA < 2.4 V
0.25
Not allowed
Not allowed
0.7
Not allowed
4
0.5625
0.8
Not allowed
2.0
1.0
9
1
2.0
0.8
4.0
3.0
16
1.5
3.0
1.8
6.0
4.5
24
3
6.8
4.0
15.0
10.0
48
6
15.0
10.0
30.0
20.0
96
12
32.0
25.0
50.0
40.0
192
24
50.0
50.0
50.0
50.0
384
1. Guaranteed by design.
2.
rNeudmubceerdowf istahmrepslepseccatlctoultahteedmfoinr ifmADuCm=s1a6mMpHlinz.gFtoimr feATDsC
= 8 and
(us).
4
MHz
the
number
of
sampling
cycles
can
be
General PCB design guidelines
Power supply decoupling should be performed as shown in The 10 nF capacitors should be
ceramic (good quality). They should be placed as close as possible to the chip.
DocID17659 Rev 12
97/133
104
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