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STM8S105S6B6 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
'STM8S105S6B6' PDF : 121 Pages View PDF
STM8S105xx
Package characteristics
11.2.4
32-lead VFQFPN package mechanical data
Figure 50: 32-lead very thin fine pitch quad flat no-lead package (5 x 5)
Seating plane
C
A3
D
e
9
8
A
A1
ddd C
16
17
E2 b
E
Pin # 1 ID
R = 0.30
1
32
D2
Bottom view
24
L
L
42_ME
Note:
1. The exposed pad must be soldered to the PCB. It is recommended to connect it to
VSS.
Table 55: 32-lead very thin fine pitch quad flat no-lead package mechanical data
Dim.
mm
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.80
0.90
1.00
0.0315
0.0354 0.0394
A1
0
0.02
0.05
0.0008 0.0020
A3
0.20
0.0079
b
0.18
0.25
0.30
0.0071
0.0098 0.0118
D
4.85
5.00
5.15
0.1909
0.1969 0.2028
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