STM8S10XS6B6ATR View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STM8S10XS6B6ATR

Access line, 16 MHz STM8S 8-bit MCU, up to 32 Kbyte Flash, integrated EEPROM, 10-bit ADC, timers, UART, SPI, I²C

STMicroelectronics 

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Thermal characteristics

12 Thermal characteristics

STM8S105x4/6

The maximum junction temperature (TJmax) of the device must never exceed the values

specified in Table 18: General operating conditions, otherwise the functionality of the device

cannot be guaranteed.

The maximum junction temperature TJmax, in degrees Celsius, may be calculated using the

following equation:

TJmax = TAmax + (PDmax x JA)

Where:

 TAmax is the maximum ambient temperature in C

 JA is the package junction-to-ambient thermal resistance in C/W

 PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

 PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

 PI/Omax represents the maximum power dissipation on output pins

Where:

PI/Omax = (VOL*IOL) + ((VDD-VOH)*IOH), 

taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in

the application.

Table 56. Thermal characteristics(1)

Symbol

Parameter

Value

Thermal resistance junction-ambient

LQFP48 - 7x7 mm

Thermal resistance junction-ambient

LQFP44 - 10x10 mm

JA

Thermal resistance junction-ambient

LQFP32 - 7x7 mm

Thermal resistance junction-ambient

UFQFPN32 - 5x5 mm

Thermal resistance junction-ambient

SDIP32 - 400 ml

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

Unit

°C/W

12.1

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

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DocID14771 Rev 15

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