STPCC4 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STPCC4' PDF : 93 Pages View PDF
MECHANICAL DATA
5.2. 388-PIN PACKAGE THERMAL DATA
The structure in shown in Figure 5-4.
The 388-pin PBGA package has a Power
Dissipation Capability of 4.5W. This increases to
6W when used with a Heatsink.
Thermal dissipation options are illustrated in
Figure 5-5 and Figure 5-6.
Figure 5-4. 388-Pin PBGA structure
Signal layers
Power & Ground layers
Thermal balls
Figure 5-5. Thermal Dissipation Without Heatsink
Board
Ambient
Case
Junction
Board
Ambient
Junction
Board dimensions:
- 10.2 cm x 12.7 cm
Rca
- 4 layers (2 for signals, 1 GND, 1VCC)
6
6
The PBGA is centred on board
Rjc
Board
8.5
Rjb
Case
125
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
Ambient
- 17µm for internal layers
Rba
- 34µm for external layers
Rja = 13 °C/W
Airflow = 0
Board temperature taken at the centrecentre ba
60/93
Release 1.5 - January 29, 2002
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