STPCC4 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STPCC4' PDF : 93 Pages View PDF
DESIGN GUIDELINES
As the PCB acts as a heat sink, the layout of top
and ground layers must be done with care to
maximize the board surface dissipating the heat.
The only limitation is the risk of losing routing
channels. Figure 6-31 and Figure 6-32 show a
routing with a good thermal dissipation thanks to
an optimized placement of power and signal vias.
The ground plane should be on bottom layer for
the best heat spreading (thicker layer than internal
ones) and dissipation (direct contact with air). .
Figure 6-31. Layout for Good Thermal Dissipation - top layer
1
A
86/93
STPC ball
Via
Not Connected ball
GND ball
3.3V ball
2.5V ball (Core / PLLs)
Release 1.5 - January 29, 2002
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