STPCD0175BTC3 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STPCD0175BTC3' PDF : 48 Pages View PDF
MECHANICAL DATA
5.2 388-Pin Package thermal data
388-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
Figure 5-4. 388-Pin PBGA structure
Structure in shown in Figure 5-4.
Thermal dissipation options are illustrated in Fig-
ure 5-5 and Figure 5-6.
Signal layers
Power & Ground layers
Thermal balls
Figure 5-5. Thermal dissipation without heatsink
Board
Ambient
Case
Junction
Board
Ambient
Junction
Board dimensions:
- 10.2 cm x 12.7 cm
Rca
- 4 layers (2 for signals, 1 GND, 1VCC)
6
6
The PBGA is centered on board
Rjc
Board
8.5
Rjb
Case
125
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
Rba
Ambient
- 17µm for internal layers
- 34µm for external layers
Rja = 13 °C/W
Airflow = 0
Board temperature taken at the center balls
38/48
Issue 1.7 - February 8, 2000
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