STPS1545D/F/FP/R/G
Fig. 9: Forward voltage drop versus forward
current (maximum values).
IFM(A)
100.0
Typical values
Tj=125°C
10.0
Tj=25°C
1.0
Tj=125°C
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (epoxy printed
circuit board FR4, Cu=35µm) (D2PAK).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm²)
0
0 5 10 15 20 25 30 35 40
PACKAGE MECHANICAL DATA
TO-220FPAC
A
H
B
L2
L3
L4
Dia
L6
L7
L5
D
F1
F
E
G1
G
REF.
A
B
D
E
F
F1
G
G1
H
L2
L3
L4
L5
L6
L7
Dia.
DIMENSIONS
Millimeters
Inches
Min. Max. Min. Max.
4.4
4.6 0.173 0.181
2.5
2.7 0.098 0.106
2.5 2.75 0.098 0.108
0.45 0.70 0.018 0.027
0.75
1
0.030 0.039
1.15 1.70 0.045 0.067
4.95 5.20 0.195 0.205
2.4
2.7 0.094 0.106
10
10.4 0.393 0.409
16 Typ.
28.6 30.6
0.63 Typ.
1.126 1.205
9.8 10.6 0.386 0.417
2.9
3.6 0.114 0.142
15.9 16.4 0.626 0.646
9.00 9.30 0.354 0.366
3.00 3.20 0.118 0.126
4/7