STPS3L60-Y View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STPS3L60-Y' PDF : 7 Pages View PDF
Characteristics
STPS3L60-Y
Figure 7.
Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 8.
Junction capacitance versus
reverse voltage applied (typical
values)
5E+1 IR(mA)
1E+1
1E+0
1E-1
Tc=150°C
Tc=125°C
Tc=100°C
Tc=75°C
Tc=50°C
C(pF)
500
200
100
50
F=1MHz
Tj=25°C
1E-2
Tc=25°C
20
VR(V)
1E-3
0 5 10 15 20 25 30 35 40 45 50 55 60
10
1
VR(V)
10
100
Figure 9.
Forward voltage drop versus
forward current (low level,
maximum values)
Figure 10. Forward voltage drop versus
forward current (high level,
maximum values)
IFM(A)
5.0
IFM(A)
20
4.5
4.0
3.5
Tj=150°C
(typical values)
Tj=25°C
10
Tj=150°C
(typical values)
Tj=25°C
3.0
2.5
Tj=125°C
5
Tj=125°C
2.0
1.5
1.0
2
0.5
VFM(V)
VFM(V)
0.0
1
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead
Rth(j-a) (°C/W)
100
80
Epoxy printed circuit board FR4,
copper thickness = 35 µm
60
40
20
S(Cu) (cm²)
0
0
1
2
3
4
5
4/7
Doc ID 17537 Rev 1
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