STPS5L25B View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STPS5L25B' PDF : 5 Pages View PDF
STPS5L25
2
Package Information
Package Information
Epoxy meets UL94,V0
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1
DPAK package information
Figure 9. DPAK package outline
Note:
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This package drawing may slightly differ from the physical package. However, all the
specified dimensions are guaranteed.
DocID3626 Rev 8
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