STV-366-R01 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STV-366-R01' PDF : 30 Pages View PDF
Package mechanical data
VT5366
Table 22. LQFP dimensions (mm)
Reference
Min. (mm)
A
A1
0.050
A2
1.350
B
0.300
c
0.090
D
D1
D3
e
E
E1
E3
L
0.450
L1
k
0d
W1
W2
Typ. (mm)
1.400
0.370
9.00
7.000
5.600
0.800
9.000
7.000
5.600
0.600
1.000
3.5d
5.000
0.065
Max. (mm)
1.600
0.15
1.450
0.450
0.200
0.750
7d
Note: 1 Surface finish W1 is 0.07 Ra.
2 Ejectors are on 5.2 mm square for both top and bottom package.
3 On top package, only the identification for pin one is not an engraved ejector.
10.1
LOQFP package guidelines
The IC can be exposed a maximum of 2 times to an IR/Convection reflow solder process
having a temperature profile peak of no higher than 240 ° C.
The package/chip are lead free and is ROHS compliant.
For full handling guidelines please contact ST (doc no. 7310623).
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