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STV0042 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
STV0042
ST-Microelectronics
STMicroelectronics ST-Microelectronics
'STV0042' PDF : 24 Pages View PDF
STV0042A
PIN INTERNAL CIRCUITRY (continued)
A GND L
Doubled bonded :
- One pad connected to the left VCO, dividers,
mixers and guard ring. the guard connection is
star connected directly to the pad.
- The second pad is connected to both AGC amps
and the deemphasis amplifiers, frequency syn-
thesis and FM deviation selection circuit for both
channels.
A 12V
Doubled bonded :
- One pad connected to the ESD and guard ring.
- The second pad is connected to the main power
for all of the audio parts.
A GND R
Boubled bonded :
- One pad connected to the right VCO, dividers,
mixers and guard ring. The guard connection is
star connected directly to the pad.
- The second pad is connected to the bias block,
audio noise reduction, volume, mux and ESD.
A third bond wire on this pin is connected directly
to the die pad (substrate).
Figure 25
V 12V
Video Pads
V GND
VDD 5V
Vpp
BIP 10vpl
Vmm
Digital Pads
GND 5V
A GND L
A 12V
Audio Pads
Substrate
A GND R
205
+
BIP
12V
-
DZPN1
DZPN1
DZPN1
15/24
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