STV0684 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STV0684' PDF : 49 Pages View PDF
Package Information
STV0684
5.2 STV0684 package mechanical data
Reference
A
A1
A2
b
D
D1
E
E1
e
f
ddd
Min.
1.210
0.270
0.450
11.850
11.850
0.720
0.650
Dimensions (mm)
Typ.
1.120
0.500
12.000
10.400
12.000
10.400
0.800
0.800
Max.
1.700
0.550
12.150
12.150
0.880
0.950
0.120
Note: 1 The maximum mounted height is 1.57 mm based on a 0.37 mm ball pad diameter.
Solder paste is 0.15 mm thick with 0.37 mm ball pad diameter.
2 LFBGA stands for Low Profile Fine Pitch Ball Grid Array.
Low profile: The total profile height (Dim A) is measured from the seating plane to the top of the
component. A = [1.21 to 1.70] mm
FIne pitch: e<1.00 mm pitch.
3 The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or
metallized markings or other features of package body or integral heatslug.
A distinguishing feature can be added on the bottom surface of the package to identify the terminal
A1 corner.
Exact shape of each corner is optional.
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