TAT7461-EB View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TAT7461-EB' PDF : 8 Pages View PDF
TAT7461
75 Ω RF Amplifier
Applications Information
PC Board Layout
Core is .062” FR-4, єr = 4.7. Metal layers are 1-oz copper.
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB
land pattern has been developed to accommodate lead and
package tolerances. Since surface mount processes vary
from company to company, careful process development
is recommended.
For further technical information, refer to:
http://www.triquint.com/TAT7461
Mechanical Information
Package Information and Dimensions
This package is lead-free/RoHS-compliant. The plating
material on the leads is 100 % Matte Tin. It is compatible
with both lead-free (maximum 260 °C reflow
temperature) and lead (maximum 245 °C reflow
temperature) soldering processes.
The TAT7461 will be marked with a “TAT7461”
designator and an 8 digit alphanumeric lot code
(XXXXYYWW). The first four digits are the lot code
(XXXX). The last four digits are a date code consisting of
the year and work week (YYWW) of assembly.
Preliminary Data Sheet: Rev C 04/30/10
© 2010 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without noticee
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