TC1108-3.3VDB View Datasheet(PDF) - TelCom Semiconductor, Inc
Part Name
Description
MFG CO.
'TC1108-3.3VDB' PDF : 6 Pages View PDF
300mA CMOS LDO
TC1108
PACKAGE DIMENSIONS
3-Pin SOT-223
.264 (6.70)
.248 (6.30)
.122 (3.10)
.114 (2.90)
.287 (7.30) .146 (3.70)
.264 (6.70) .130 (3.30)
PIN 1
.091 (2.30) TYP.
.041 (1.04)
.033 (0.84)
.031 (0.80)
.024 (0.60)
.071
(1.80)
MAX.
.004 (0.10)
.001 (0.02)
.181 (4.60) TYP.
10° MAX.
.036 (0.91) MIN.
.013 (0.33)
.009 (0.24)
Dimensions: inches (mm)
Sales Offices
TelCom Semiconductor, Inc.
1300 Terra Bella Avenue
P.O. Box 7267
Mountain View, CA 94039-7267
TEL: 650-968-9241
FAX: 650-967-1590
E-Mail: liter@telcom-semi.com
TC1108-2 1/25/00
TelCom Semiconductor, GmbH
Lochhamer Strasse 13
D-82152 Martinsried
Germany
TEL: (011) 49 89 895 6500
FAX: (011) 49 89 895 6502 2
6
TelCom Semiconductor H.K. Ltd.
10 Sam Chuk Street, Ground Floor
San Po Kong, Kowloon
Hong Kong
TEL: (011) 852-2350-7380
FAX: (011) 852-2354-9957
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