TC3341 View Datasheet(PDF) - Transcom, Inc.
Part Name
Description
MFG CO.
'TC3341' PDF : 3 Pages View PDF
TC3341
Absolute Maximum Ratings
REV2_20050418
Symbol
Parameter/Conditions
Vdd Drain-Source Voltage
Idd Total Drain Current
Pin RF Input Power
Pt Power Dissipation
Tch Operating Channel Temperature
TSTG Storage Temperature
TEST CIRCUITS
Min.
-65
Max.
12
2200
10
12
175
175
Units
Volts
mA
dBm
W
°C
°C
Note:
1.This GaAs MMIC is susceptible to damage from Electrostatic
Discharge. Proper precautions should be used when handling
these devices.
2.Specifications subject to change without notice.
Evaluation Board Schematic
EVALUATION BOARD
PCB Material: RO4003
ER = 3.38
Thickness = 20 mil
Unit: mil
* DXF file of the PCB can be downloaded from our
web-site at www.transcominc.com.tw
* Application Notes:
For better heat sinking and grounding, it's recommended
to have the via holes beneath TC3341 filled with solder
and have two screws installed on required heat sink plate
besides TC3341 on the PCB area.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
P2/3
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