TC670ECH View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'TC670ECH' PDF : 14 Pages View PDF
5.3 Package Dimensions (6-Pin SOT-23)
E
E1
TC670
B
p1 D
n
1
α
c
A
A2
φ
L
A1
β
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
Number of Pins
n
6
Pitch
p
.038
6
0.95
Outside lead pitch (basic)
p1
.075
1.90
Overall Height
A
.035
.046
.057
0.90
1.18
Molded Package Thickness
A2
.035
.043
.051
0.90
1.10
Standoff
A1
.000
.003
.006
0.00
0.08
Overall Width
E
.102
.110
.118
2.60
2.80
Molded Package Width
E1
.059
.064
.069
1.50
1.63
Overall Length
D
.110
.116
.122
2.80
2.95
Foot Length
Foot Angle
L
.014
.018
.022
0.35
0.45
φ
0
5
10
0
5
Lead Thickness
c
.004
.006
.008
0.09
0.15
Lead Width
B
.014
.017
.020
0.35
0.43
Mold Draft Angle Top
α
0
5
10
0
5
Mold Draft Angle Bottom
β
0
5
10
0
5
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
MAX
1.45
1.30
0.15
3.00
1.75
3.10
0.55
10
0.20
0.50
10
10
JEITA (formerly EIAJ) equivalent: SC-74A
Drawing No. C04-120
2003 Microchip Technology Inc.
DS21688C-page 9
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