TDA2009 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TDA2009' PDF : 12 Pages View PDF
TDA2009A
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
Thanks to the MULTIWATT ® package attaching
Figure 18 : Maximum Allowable Power Dissipa-
tion versus Ambient Temperature
the heatsink is very simple, a screw or a compres-
sion spring (clip) being sufficient. Between the
heatsinkand the package it is better to insert a layer
of silicon grease, to optimize the thermal contact ;
no electrical isolation is needed between the two
Figure 19 : Output Power versus Case
Temperature
Figure 20 : Output Power and Drain Current ver-
sus Case Temperature
10/12
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