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TDA7262 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
TDA7262
ST-Microelectronics
STMicroelectronics ST-Microelectronics
'TDA7262' PDF : 8 Pages View PDF
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TDA7262
Figure 11: Total Power Dissipation & Efficiency
vs. Output Power
Figure 12
BUILD-IN PROTECTION SYSTEMS
Thermal shut-down
The presence of a thermal limiting circuit offers
the following advantages:
1) an overload on the output (even if it is perma-
nent), or an excessive ambient temperature
can be easily withstood.
2) the heatsink can have a smaller factor of
safety compared with that of a conventional
circuit. There is no device damage in the case
of excessive junction temperature; all that
happens is that PO ( and therefore Ptot) and
IO are reduced. The maximum allowable
power dissipation depends upon the size of
the external heatsink (i.e. its thermal resis-
tance); Figure 12 shows this dissipable power
as a function of ambient temperature for dif-
ferent thermal resistance.
Short circuit (AC Conditions)
The TDA7262 can withstand accidental short cir-
cuits across the speaker made by a wrong con-
nection during normal play operation.
MOUNTING INSTRCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
Thanks to the MULTIWATT package attaching
the heatsink is very simple, a screw or a com-
pression spring (clip) being sufficient. between
the heatsink and the package it is better to insert
a layer of silicon grease, to optimize the thermal
contact; no electrical isolation is needed between
the two surfaces.
6/8
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