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TDA7266P View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
TDA7266P
ST-Microelectronics
STMicroelectronics ST-Microelectronics
'TDA7266P' PDF : 11 Pages View PDF
1 2 3 4 5 6 7 8 9 10
TDA7266P
Figure 18. PowerSSO24 Mechanical Data & Package Dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.15
2.47 0.084
0.097
A2 2.15
2.40 0.084
0.094
a1
0
0.075 0
0.003
b 0.33
0.51 0.013
0.020
c 0.23
0.32 0.009
0.012
D (1) 10.10
10.50 0.398
0.413
E (1) 7.4
7.6 0.291
0.299
e
0.8
0.031
e3
8.8
0.346
G
0.10
0.004
G1
0.06
0.002
H 10.10
10.50 0.398
0.413
h
0.40
0.016
L 0.55
0.85 0.022
0.033
N
10˚ (max)
X 4.10
4.70 0.161
0.185
Y 6.50
7.10 0.256
0.279
(1) “D and E1” do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.15mm (0.006”)
(2) No intrusion allowed inwards the leads.
(3) Flash or bleeds on exposed die pad shall not exceed 0.4 mm
per side
OUTLINE AND
MECHANICAL DATA
PowerSSO24
10/12
7412828 A
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