TDA7402 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TDA7402' PDF : 69 Pages View PDF
TDA7402
10 Package information
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 39. LQFP44 (10x10) mechanical data and package dimensions
Obsolete
DIM.
) A
MIN.
mm
TYP.
MAX.
1.60
MIN.
inch
TYP. MAX.
0.0630
t(s A1 0.05
0.15 0.0020
0.0059
c A2 1.35 1.40 1.45 0.0531 0.0551 0.0571
u b 0.30 0.37 0.45 0.0118 0.0146 0.0177
d c 0.09
0.20 0.0035
0.0079
ro D 11.80 12.00 12.20 0.4646 0.4724 0.4803
D1 9.80 10.00 10.20 0.3858 0.3937 0.4016
P D2 2.00
0.0787
te D3
8.00
0.3150
le E 11.80 12.00 12.20 0.4646 0.4724 0.4803
E1 9.80 10.00 10.20 0.3858 0.3937 0.4016
so E2 2.00
b E3
8.00
0.0787
0.3150
O e
0.80
0.0315
- L 0.45 0.60 0.75 0.0177
0.0295
) L1
1.00
0.0394
t(s K
3.5˚(m in.),7˚ (max.)
ccc
0.10
0.0039
c Note: 1. The size of exposed pad is variable depending of lead-
u frame design pad size. End user should verify “D2” and
Prod“E2” dimensions for each device application.
OUTLINE AND
MECHANICAL DATA
LQFP44 (10 x 10 x 1.40mm)
Exposed Pad Down
7278839 C
67/69
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