TDA7719 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TDA7719' PDF : 45 Pages View PDF
Package information
6
Package information
TDA7719
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 23. TSSOP28 mechanical data and package dimensions
DIM.
MIN.
mm
TYP. MAX.
MIN.
inch
TYP. MAX.
A
1.200
0.047
A1 0.050
0.150 0.002
0.006
A2 0.800 1.000 1.050 0.031 0.039 0.041
b 0.190
0.300 0.007
0.012
c 0.090
0.200 0.004
0.008
D 1 9.600 9.700 9.800 0.378 0.382 0.386
E 6.200 6.400 6.600 0.244 0.252 0.260
E11 4.300 4.400 4.500 0.170 0.173 0.177
e
0.650
0.026
L 0.450 0.600 0.750 0.018 0.024 0.030
L1
1.000
0.039
k
0˚ (min.), 8˚ (max.)
aaa
0.100
0.004
Note: 1. D and E1 does not include mold flash or protrusions.
Mold flash or potrusions shall not exceed 0.15mm
(.006inch) per side.
OUTLINE AND
MECHANICAL DATA
TSSOP28
Thin Shrink Small Outline Package
JEDEC MO-153-AC
44/46
Doc ID 13698 Rev 5
0128292 B
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