Philips Semiconductors
Double multiprotocol IC card interface
Product specification
TDA8007B
CHARACTERISTICS
VDD = 3.3 V; VSS = 0 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
Supplies
VDD
IDD(pd)
supply voltage
supply current in
Power-down mode
2.7
VDD = 3.3 V; cards inactive;
−
XTAL oscillator stopped
VDD = 3.3 V; cards active at
−
VCC = 5 V; CLK stopped;
XTAL oscillator stopped
IDD(sm)
supply current in Sleep
mode
both cards powered, but with CLK −
stopped
IDD(om)
Vth1
supply current in operating
mode
threshold voltage on VDD
(falling)
ICC1 = 65 mA; ICC2 = 15 mA;
fXTAL = 20 MHz; fCLK = 10 MHz;
5 V cards; VDD = 2.7 V
ICC1 = 50 mA; ICC2 = 30 mA;
fXTAL = 20 MHz; fCLK = 10 MHz;
3 V cards; VDD = 2.7 V
ICC1 = 50 mA; ICC2 = 30 mA;
fXTAL = 20 MHz; fCLK = 10 MHz;
3 V cards; VDD = 5 V
−
−
−
2.25
Vhys1
hysteresis on Vth1
50
Vth2
threshold voltage on pin
−
DELAY
VDELAY
voltage on pin DELAY
−
Io(DELAY)
output current at pin DELAY pin grounded (charge)
−
VDELAY = VDD (discharge)
−
CDELAY
capacitance value
1
tW(ALARM) ALARM pulse width
CDELAY = 22 nF
−
RSTOUT (open-drain active HIGH output)
IOH
HIGH-level output current
VOL
LOW-level output voltage
IOL
LOW-level output current
VOH
HIGH-level output voltage
Crystal oscillator
active LOW option; VOH = 5 V
active LOW option; IOL = 2 mA
active HIGH option; VOL = 0 V
active HIGH option; IOH = −1 mA
−
−0.3
−
0.8VDD
fXTAL
crystal frequency
4
fext
external frequency applied
0
to pin XTAL1
TYP. MAX. UNIT
−
6.0
V
−
350
µA
−
3
mA
−
5.5
mA
−
315
mA
−
215
mA
−
100
mA
−
2.50
V
−
170
mV
1.25 −
V
−
VDD + 0.3 V
−2 −
µA
2
−
mA
−
−
nF
10 −
ms
−
10
µA
−
+0.4
V
−
−10
µA
−
VDD + 0.3 V
−
25
−
25
MHz
MHz
2000 Nov 09
24